Research Output
PVDF sensors with low-temperature bonding techniques
  The performances of poly-vinylidene fluoride (PVDF) thin-film infrared sensors with alternative bonding methods are presented in comparison with a more established method. A responsivity of 25 V (W cm−2)−1 is achieved using a commercially available acrylic adhesive. This method removes the requirement of raised temperature treatment of the PVDF thin-film material, which is prone to thermal damage at relatively low temperatures.

  • Type:

    Article

  • Date:

    30 June 1995

  • Publication Status:

    Published

  • Publisher

    Elsevier BV

  • DOI:

  • Cross Ref:

    092442479501010X

  • ISSN:

    0924-4247

  • Funders:

    Edinburgh Napier Funded

Citation

Â鶹ÉçÇø

Webster, S., & Binnie, T. (1995). PVDF sensors with low-temperature bonding techniques. Sensors and Actuators A: Physical, 49(1-2), 61-65. https://doi.org/10.1016/0924-4247%2895%2901010-x

Authors

Keywords

Infrared sensors, Low-temperature bonding, Poly-vinylidene fluoride, Thin films

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